Hybrid copper–silver conductive tracks for enhanced oxidation resistance under flash light sintering. Transparent conductive silver nanowire electrodes with high resistance to oxidation and thermal shock. Journal of Materials Chemistry C, 2(2), 286–294. Fabrication of flexible copper-based electronics with high-resolution and high-conductivity on paper via inkjet printing. Direct synthesis and inkjetting of silver nanocrystals toward printed electronics. All-inkjet-printed flexible electronics fabrication on a polymer substrate by low-temperature high-resolution selective laser sintering of metal nanoparticles. Room temperature synthesis of a copper ink for the intense pulsed light sintering of conductive copper films. High yield, single droplet electrode arrays for nanoscale printed electronics. As a result, hybrid paste pattern sintered with IPL showed excellent oxidation resistance (resistance increase rate in 300 ☌ for 5 h: 4.92%), and high electrical conductivity (6.54 μΩ cm). In addition, to confirm the heat generation with respect to the packing density of the hybrid pastes, in-situ temperature monitoring process was conducted. The packing density of the hybrid pastes was investigated using CATIA digital mock-up (DMU) program. To demonstrate the mechanism of the sintering process on hybrid pastes, heat generation at the junctions between particles were simulated using Multiphysics COMSOL program. To analyze the sintering and oxidation characteristics of hybrid pastes (Ag NPs + core–shell MPs), a scanning electron microscope (SEM) and a focused ion beam (FIB) was used. To increase the packing density of the pastes and its oxidation resistance, Ag nanoparticles (Ag NPs) were added to Cu/Ag core–shell microparticles (core–shell MPs) paste with optimal mass ratio. pulse duration, irradiation energy) was optimized to obtain high conductivity and good oxidation resistance characteristics. It was sintered via intense pulsed light (IPL) sintering technique. In this study, a silver (Ag) coated copper (Cu) core–shell microparticles paste were fabricated and screen-printed on Polyimide (PI) substrates.

Core shell copper